IC載板
高精度尺寸量測
因應 IC 載板層數及厚度增加，以及封測製程需求，實施高精度量測，包括正面／背面尺寸、天地邊、切割邊緣以及缺口孔位，量測精度達 ±5 μm，並建置預警系統，協助預判刀具磨損程度與產線維護時機。
HIGH ACCURACY DIMENSION MEASUREMENT
In response to increasing IC substrate layer counts, thickness, and packaging process requirements, high-precision measurements are implemented.
Measurement items include frontside/backside dimensions, top/bottom edges, sawing edges, and notch hole positions, with an accuracy of ±5 μm.
A predictive warning system is also established to monitor tool wear conditions and optimize maintenance timing for production lines.