IC Substrate
加熱電測機
避免IC載板到封裝製程或產品化後才發現異常，造成更大的損失；將IC載板在還沒有上晶片前，就先加熱到125度C高溫，進行電測測試。僅需 數十秒即可加熱至 125°C，且控溫精度達 ±1°C，適用於對溫度條件要求嚴格的先進製程。
HEATING OPEN SHORT TESTER
To prevent costly defects from being discovered only after IC substrates enter the packaging process or final products, electrical testing is performed by preheating the substrates to 125°C before chip assembly.
The system can rapidly heat to 125°C within tens of seconds, with temperature control accuracy of ±1°C, making it ideal for advanced processes with stringent thermal requirements.