IC Substrate
玻璃基板量測
玻璃基板製程開發需要精準掌控尺寸、輪廓幾何、孔徑孔深、高溫翹曲(Warpage）量測等；以確保可靠度符合量產規範。
Glass Substrate Measurement
Glass substrate process development requires precise measurement of dimensions, geometric profiles, hole diameter and depth, as well as high-temperature warpage, to ensure reliability meets mass production standards.