IC Substrate
盲孔檢測
針對 IC 載板的高速檢測方案，採用經熱模擬與光學實驗驗證的光學配置，具備高度穩定性與準確性，能有效檢查盲孔品質。
Laser Via Bottom AOI
The high-speed inspection solution for IC substrates adopts an optical configuration validated through thermal simulations and optical experiments, ensuring excellent stability and accuracy for effective blind via quality inspection.