半導體
INTERPOSER內埋量測
興城因應CoWoS製程相關高階AI/CPU/GPU晶片，內埋式Interposer檢量測方案。
核心技術亮點：
- 採用自主開發電測 ASIC 晶片，高速精準量測。
- 內建 LCR 測量模組，精準無干擾。
- 消除複雜佈線，提升系統穩定性。
- 精準對應Interposer Bump Size < 20 μm量測 。
Interposer Embedded Inspection
In response to CoWoS packaging needs for high-end AI/CPU/GPU chips,
we offer embedded interposer inspection solutions.
Core Technologies:
- Development of proprietary high-speed ASIC chips for precision measurement
- Embedded LCR test modules for contact high-precision probing
- Compensates for complex parasitic effects, accurately and without interference, to enhance system stability
- High-precision alignment for interposer bump sizes < 20 μm